Researchers from MIPT have found a solution to the problem of overheating of active plasmonic components. These components will be essential for high-speed data transfer within the optoelectronic microprocessors of the future, which will be able to function tens of thousands of times faster than the microprocessors currently in use today. In the paper published in ACS Photonics the researchers have demonstrated how to efficiently cool optoelectronic chips using industry-standard heatsinks in spite of high heat generation in active plasmonic components.
Temperature distribution in an active plasmonic waveguide on an optoelectronic chip with a cooling system.
In Moscow’s Phystech institute, physicists develop a cooling system for the processors of the futureRead More
